MEMS: Outside chip enclose class to design a consideration

Time:2023-06-26 11:36:54
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source:CLAREY CNC Machining

Of MEMS parts of an apparatus enclosing a form is the crucial factor that postpones the systematic plan that is based on MEMS to the market. Consider to discover, in the typical product that is based on MEMS now, enclose cost to occupy the 20% ～ that went belongings expects and assembling cost almost 40% . Because produce the effect of the element, make the test cost after enclosing higher than the test cost of class of parts of an apparatus, this makes of MEMS product it is more important to enclose choice and design. Before group of design of MEMS parts of an apparatus is beginning every design, and perforative must be opposite in whole design technological process enclose strategy and how to undertake consideration and accord huge pay close attention to eclectically. A lot of MEMS product suppliers can enclose the product the main product diversity that competes to have the market and competitive advantage. Enclose what selection rule designs MEMS parts of an apparatus often compare those who design common integrated circuit to enclose more complex, because the engineer often wants to abide by a few additional design obligations,this is, and the requirement that contented job issues in cruel ambient conditions. Parts of an apparatus should very as apparent as the medium that is measured area can fall to be fastened in such severe exacting environment. These medium may be gentle like dry air, perhaps wait for same Yan Ke like radiate of blood, radiator. Other medium still include to have the environment when measuring, for example, concussion, shake, temperature change, moisture and EMI/RFI. Above all, of MEMS parts of an apparatus enclose must can have mutual effect with the environment. For example, the pressure input of pressure sensor, blood handles the fluid entrance of parts of an apparatus to wait. Of MEMS parts of an apparatus enclose also must satisfy a few otherer machinery and medicinal powder demand of the capacity that heat up abundant. Regard MEMS as the output of parts of an apparatus, the likelihood is the change of mechanical electric machinery or pressure, accordingly, enclosed mechanical parasitism phenomenon is affected likely each other with the function of parts of an apparatus and disturb. For example, inside piezoresistive transduser, enclose stress to be able to affect the output of sensor. In should be being enclosed, different material mixes when using, their expand to differ with contractive coefficient, accordingly, the stress that these change cause is additional in the pressure value in sensor. In optical MEMS parts of an apparatus, because pound, shake or heat up those who expand to wait for a reason and arise to enclose stress to be able to make smooth parts of an apparatus is mixed fiber-optic the alignment between produces deflection. In high accuracy accelerometer and gyroscope, enclose need and MEMS chip segregation in order to optimize function (1) seeing a picture. Graph round class of 1 groovy brilliant is enclosed (of the type of MEMS parts of an apparatus that basis of WLP) structure sketch map produces different, the consideration of electronic function can decide what to choose the strategy that encloses a type. For example, it is very small, OK that capacitance passes feeling MEMS parts of an apparatus to be able to arise the charge that is spotted by electronic parts place, need special attention when the design circuit and the signal integrality problem in enclosing. Normally, the systematic program that great majority is based on MEMS offers corresponding circuit compensation, control and signal processing unit to MEMS chip. Accordingly, chip of a MEMS and custom-built ASIC chip are OK by compositive in same enclose inside. Same, circuit also can be compositive the odd chip of MEMS parts of an apparatus, sheet is enclosed (2) seeing a picture. Graph parts of an apparatus of MEMS of accelerometer of constant temperature of 2 odd chip also uses brilliant round class to enclose sometimes, use protective cap MEMS sealed rise, the segregation of implementation and external environment or mobile protection is provided to MEMS parts of an apparatus before be enclosed next time. This technology often uses at inertial chip enclose, be like gyroscope and accelerometer. Such enclosing move sorts an implementation in the process in MEMS, need handles flow operation according to brilliant circle in clean environment. photograph comparing, the chip class after brilliant circle is finished by cut finishs the much of integrated circuit is enclosed, clean to enclosing the environment of the process degree does not have particularly high demand. MEMS chip architect is willing to use the level with very low cost to enclose a form more, because this is used plastic enclose or enclose compatibly with integrated circuit, this can use the cost dominant position of domain of integrated circuit industry. Use standard is enclosed also reduced design and test time, the cost that encloses itself is very low also. A current standard is, if MEMS parts of an apparatus is OK,installation is on PCB board, it uses standard integrated circuit likely to enclose a form (3) seeing a picture. Graph system of 3 miniature smooth machine (the tubal core of MOEMS) exchange parts of an apparatus by 4 fiber-optic join with jumper, the Covar metal that is enclosed in industrial standard is enclosed inside however, parts of an apparatus of MEMS of current great majority is enclosed is the client is custom-built, and right special applying undertook optimizing. So, standard integrated circuit is enclosed cannot bear in front the influence that those describes astringent conditions bring to medium place. The challenge that MEMS parts of an apparatus encloses is two fields that prospective place uses in great quantities: Medical treatment electron and car electron. In these two kinds of application, the medium that is measured to MEMS parts of an apparatus it is very astringent. In car electron domain, need measures heat radiation of internal-combustion engine engine oil, fuel, cooling fluid, tail gas to arrange the pressure that wait or chemical part. These two domains ask to have high reliability and extremely solid characteristic to parts of an apparatus. So, macrobian life (especially medical but embedded equipment) , small size (compatibility of material of 4) seeing a picture, biology (5) seeing a picture is the biggest problem that when choosing to enclose design, material and interface, faces. Graph the weaveform of pressure of embedded core dirty blood stream of 4 wireless, beardless batteries monitors equipment tradition ME pursues 5 high density spend cochlear and embedded system to use handkerchief of silicon of a quartz to pull glue to enclose craft, it can offer good biology compatibility, flexibility and the firm sex that use for a long time. MS parts of an apparatus encloses a form inchoate MEMS parts of an apparatus encloses a form to use SOC(System-on-Chip: Piece on system) technology, assemble parts of an apparatus or appliance of one or more MEMS with CMOS craft, incorporate imitate and digital technology. MEMS product also can use SIP(System-in-Package: Enclose inside system) the technology discusses in front in enclosing compositive two or many chip. Build wiring (Wire-bonding) is used at join to enclose the chip inside, incorporate MEMS chip. Nowadays, this kind of technology is being fallen mediumly to install chip to enclose technical place to replace by domain of integrated circuit production (6) seeing a picture. Graph 6 parts of an apparatus is exchanged in telegraphic light (rock-bottom canal core) dominate circuit with CMOS (core of canal carrying a layer on the head) pile join is in previously, engineer often the final phase that encloses a design to stay after crucial sensor and circuit design are finished. However, change produced below the concussion of technological process of this kind of design in pressure of product range city and intense competition, force an engineer to change their design method. Otherwise, the inferior position that the product encloses will miss admirable market window. Additional, because design tool deficient, do not have when stress or other influencing factor by reasonable when evaluating, make the design fails. New-style development tool is current, the level that is used at enclosing the new technology of the design to had been close to MEMS parts of an apparatus to make. Silicon via (TSV) etchs the technology can realize the brilliant circle that is as high as M of 100 much μ to etch deepness. Accordingly, the technology that MEMS brilliant round factory can use this kind to produce same level with MEMS will make enclosed. Silicon via (of TSV) apply make additionally one kind of technology is able to come true, that is technology of much chip pile. This technology encloses the pile tubal core of many chip in in, join together through silicon via. Chip pile makes of chip enclose smaller, but can make enclose can become more complex. Quantity of heat must be delivered between the chip that pile must be close to extremely, arise thereby medicinal powder additionally the stability of rigid structure also must emulate hot issue; carefully in order to ensure good performance and dependability. Traditional integrated circuit encloses a factory to also begin to offer special MEMS parts of an apparatus to enclose at present, and devoted also development encloses equipment supplier newly and test equipment. Accordingly, of MEMS parts of an apparatus enclosing a choice is very much. MEMS parts of an apparatus is many more compositive sensor, and the system that will offer higher additional cost with corresponding software form a complete set is enclosing solution direction to develop to much chip gradually. Chip pile can pass means production, also can enclose means to undertake through brilliant round class. One of did not develop a trend enclose a technology important new way is to use flexible underlay encloses many rigid parts of an apparatus together. Many sensor can reach power module to be combined together with electronic unit. Pass fold, the systematic dimension that is enclosed together can be done very smally. This kind of technology to can appareling human body sensor is very charming. When integrated circuit domain when enclosing a supplier to pay close attention to other and additional cost, enclosed standardization is possible, but the time with this very long need. In what place, will draft this standard to also need many time by who. Because MEMS and semiconductor brilliant round factory and tradition enclose the competition between the factory to will make,this is newest with highest function enclose a technology to be able to develop, also make brilliant round factory begins more traditional semiconductor to provide a service for MEMS industry. CNC Milling